Design Service 2.0

Custom Design

Design Service 2.0 by zapRF offers a true turnkey solution—transforming your specifications into fully-fabricated, production-ready RFIC or MMIC chips.

- Cut design time by 99% and reduce fabrication costs by over 20× compared to traditional vendors.

- Supports DC to 100 GHz, and enables heterogeneous integration, and covers GaAs and GaN processes for PAs, LNAs, or front-end modules.

For customers seeking accelerated chip design without fabrication, our design-only offering takes your specifications and returns a validated GDSII layout optimized for tape-out.

- This path offers all the benefits of custom, high-performance design—without the delays or overhead of conventional engagements. It's ideal for teams with existing foundry relationships or specialized packaging needs.

- Designs are delivered in weeks, with full support for wideband applications and complex integration scenarios.

Full Turnkey Service